Semi Pac Inc.semiconductor assembly, assembly semiconductor, wafer dicing service, wafer dicing services, nitto denko wafer dicing, wafers dicing, dicing wafers, dicing silicon wafers, silicon wafer dicing, wire bonding, aluminum wire bonding, chip wire bonding

Semi-Pac Inc. has several patents on next generation wafer bumping technologies

This next generation process provides best uniformity, improved bump yield, and best reliability compared to existing methods