Semi Pac Inc.semiconductor assembly, assembly semiconductor, wafer dicing service, wafer dicing services, nitto denko wafer dicing, wafers dicing, dicing wafers, dicing silicon wafers, silicon wafer dicing, wire bonding, aluminum wire bonding, chip wire bonding

Patented next generation wafer bumping technologies

Custom sensor design and packaging

Industry Leading semiconductor packaging innovations

We have experience in most types of semiconductor packaging processes and materials.

Innovative solutions have been developed for many clients


Advanced package design and development.

Ultra small sensor development, pressure, temperature sensors developed for implantable catheter