Semi Pac Inc.semiconductor assembly, assembly semiconductor, wafer dicing service, wafer dicing services, nitto denko wafer dicing, wafers dicing, dicing wafers, dicing silicon wafers, silicon wafer dicing, wire bonding, aluminum wire bonding, chip wire bonding

Reliability SERVICES

Semi-Pac Inc. has over 25 years of experience in reliability testing offering best in class service.

Specializing in package level reliability testing, HCI, TDDB, EM sample preparation with proprietary assembly methods and materials to meet the high temperature demands of todays reliability stress tests.

Semi-Pac offers Wafer Saw Back grind, Ceramic or specialty packages, and full die traceability. 

Semi-Pac certified to 7nm with 300MM compatible assembly line Located in Silicon Valley California