Reliability services

Semi Pac Inc. has vast experience in medical

device development

On-site assembly service
Process Development
Fresh Innovation
Reliability expertise
Patented technology
Medical compliance

Semi Pac Inc. offers advanced

packaging services

Semi Pac Inc. has experience in product development

Semi Pac Inc.semiconductor assembly, assembly semiconductor, wafer dicing service, wafer dicing services, nitto denko wafer dicing, wafers dicing, dicing wafers, dicing silicon wafers, silicon wafer dicing, wire bonding, aluminum wire bonding, chip wire bonding

“Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”

Semiconductor

wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging

TESTIMONIALS

OUR SERVICES

Products

Wafer Bumping

Companies of all kinds have used Semi-Pac for their project requirements.

Medical

Next generation ultra low cost

Wafer and substrate bumping

technologies