Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”


wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging  

leading experts in reliability

sampling for quality monitoring




Reliability services

Wafer Bumping

Semi Pac Inc. has vast experience in medical

device development

Companies of all kinds have used Semi-Pac for their project requirements.

  • On-site assembly service
  •  Process Development
  • Fresh Innovation
  •  Reliability expertise
  •  Patented technology
  •  Medical compliance


Semi Pac Inc. offers advanced

packaging  services

Semi Pac Inc. has  experience in product development

Next generation ultra low cost

Wafer and substrate bumping


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