leading experts in reliability

sampling for quality monitoring

Reliability services

Semi Pac Inc. has vast experience in medical

device development

  • On-site assembly service
  •  Process Development
  • Fresh Innovation
  •  Reliability expertise
  •  Patented technology
  •  Medical compliance

Semi Pac Inc. offers advanced

packaging  services

Semi Pac Inc. has  experience in product development

Semi Pac Inc.semiconductor assembly, assembly semiconductor, wafer dicing service, wafer dicing services, nitto denko wafer dicing, wafers dicing, dicing wafers, dicing silicon wafers, silicon wafer dicing, wire bonding, aluminum wire bonding, chip wire bonding

Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”

Semiconductor

wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging  

TESTIMONIALS

OUR SERVICES

Products

Wafer Bumping

Companies of all kinds have used Semi-Pac for their project requirements.

Medical

Next generation ultra low cost

Wafer and substrate bumping

technologies