Semi Pac Inc. offers advanced packaging services and innovative process development for your most challenging projects
experience in Medical product development
Patented Next generation ultra low cost Wafer bumping
Semiconductor Packaging Excellence
Space / Commercial / Medical Systems
wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging
Semi Pac Inc. has vast experience in medical
device development
Semi - Pac works with world class clients
“Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”
Experts in assembly of reliability samples for quality monitoring
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+1.4087343832
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