Semi Pac Inc. offers advanced packaging  services and innovative process development for your most challenging projects

 experience in Medical product development

Patented Next generation ultra low cost Wafer  bumping

  • On-site assembly service
  •  Process Development
  •  Reliability expertise
  •  Patented technology
  •  Medical compliance


SeMi - Pac InC. 

Semiconductor Packaging Excellence

Space  / Commercial / Medical Systems

wire bonding services wafer sawing wafer dicing service wafer scribing. PCB wire bonding printed circuit board assembly die preparation die inspection semiconductor packaging  

Semi Pac Inc. has vast experience in medical

device development

Semi - Pac works with world class clients

Semi Pac Inc. delivered everything they promised. Our customer satisfaction levels are at an all-time high!”

Semiconductor Packaging

Experts in assembly of reliability samples for quality monitoring